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I would like to introduce examples of hole processing in alumina and SUS.
Laser Processing Examples 3. Hole Processing in Ceramics *Photos are also included in the PDF catalog. Please download and check. [Example] Material: Alumina Hole Diameter: 50μ Pitch: 0.25mm Using a 400W fiber laser from Furukawa Electric, hole processing has been performed on 0.65T alumina.
Ideal for micro-hole processing of molds. Achieves high precision and high-quality finishes.
In the mold industry, the precision of micro-hole processing, which affects product quality, is crucial. In particular, high-precision molds significantly impact the durability and performance of products. Traditional processing methods face challenges in accuracy and efficiency, which can hinder the production of high-quality products. The LTC6050 achieves high-level micro-processing with a minimum beam diameter of Φ10μm, addressing the challenges in micro-hole processing for molds. 【Application Scenarios】 - Micro-hole processing for molds - Processing of shims, gaskets, springs, etc. - Processing from ultra-thin materials to thin plates 【Benefits of Implementation】 - Improved product quality through high-precision micro-hole processing - Increased productivity due to reduced processing time - Expanded processing range by accommodating various materials
